I have a 6s+ in immaculate condition with a no service issue, the gentleman is an older fellow and has looked after the phone really well. The device looks to have no bends (under my level) and no signs of a drop.
The phone has never been opened and according to him just lost service one day so gives me no start point.
I have checked imei, carrier, serial etc in settings and all are present. I have done a visual inspection of the rf area (both sides) checked for dead shorts, checked for odd diode readings and couldn't see anything.
So i looked at bb_pmu (u_pmu_rf) as i have had issues in past with this, and rebelled in case of dry solder joint or cracks, this brought the service back and customer went away happy, after 2 weeks the same happened so I thought maybe the fault was the chip so changed the chip again this worked for a few days this time and the same happened.
My thinking is I'm inadvertently "re-hotting" one of the ics in the general area, probably bb_cpu (as directly on other side) causing the tempory "fix".
My question is, is there any tests I can do to bb_cpu before I lift to reball or any other known culprits that could be an issue. The problem goes away with heat to that area so im thinking a pad/ic or joint is to blame.
The phone has never been opened and according to him just lost service one day so gives me no start point.
I have checked imei, carrier, serial etc in settings and all are present. I have done a visual inspection of the rf area (both sides) checked for dead shorts, checked for odd diode readings and couldn't see anything.
So i looked at bb_pmu (u_pmu_rf) as i have had issues in past with this, and rebelled in case of dry solder joint or cracks, this brought the service back and customer went away happy, after 2 weeks the same happened so I thought maybe the fault was the chip so changed the chip again this worked for a few days this time and the same happened.
My thinking is I'm inadvertently "re-hotting" one of the ics in the general area, probably bb_cpu (as directly on other side) causing the tempory "fix".
My question is, is there any tests I can do to bb_cpu before I lift to reball or any other known culprits that could be an issue. The problem goes away with heat to that area so im thinking a pad/ic or joint is to blame.
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